物料参数
| Interfaces: | Parallel |
| Lead Ball Finish: | Sn/Ag/Cu |
| Peak Reflow Temp: | 260.0°C |
| Speed: | 35.0ns |
| Operating Temperature: | None°C |
| Organization (X x Y): | 32Kb x 8 |
| Qualification: | Industrial |
| Density: | 256.0kBit |
| Operating Voltage: | NoneV |
无库存
| Interfaces: | Parallel |
| Lead Ball Finish: | Sn/Ag/Cu |
| Peak Reflow Temp: | 260.0°C |
| Speed: | 35.0ns |
| Operating Temperature: | None°C |
| Organization (X x Y): | 32Kb x 8 |
| Qualification: | Industrial |
| Density: | 256.0kBit |
| Operating Voltage: | NoneV |